Welcome to our Website. Power Package Innovation and Technology. Latest News           As part of the ESCAPE project Tribus-D have developed a revolutionary new Power Package with fully embedded SiC devices to support the drive for electrification. The package eliminates the need for wire bonds and an integrated Direct Copper Bonded substrate, to enable increased power density, simplified thermal management in a flexible designed constructed package. For more information on Escape select the projects button below or contact us using the mail link at the foot of the page. Please contact Tribus-D to discuss how we can support your project.  ©TTribus-D Ltd © 2024