As
part of the ESCAPE project Tribus-D
have developed a revolutionary new Power Package with fully embedded
SiC devices to support the drive for electrification. The package
eliminates the need for wire bonds and
an integrated Direct Copper Bonded substrate, to enable
increased power density, simplified thermal management in a flexible
designed
constructed package. For more information on Escape select the projects
button below or contact us using the mail link at the foot of the page.
Please
contact
Tribus-D to discuss how we can support your project.